The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Mar. 12, 2014
Applicants:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Shibaura Mechatronics Corporation, Yokohama-shi, JP;

Inventors:

Takahiro Aizawa, Yokohama, JP;

Noboru Kuriyama, Yokohama, JP;

Miki Mori, Yokohama, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); B23K 20/10 (2006.01); B06B 1/02 (2006.01); B29C 65/08 (2006.01); B06B 3/00 (2006.01);
U.S. Cl.
CPC ...
B23K 20/10 (2013.01); B29C 65/08 (2013.01); B06B 1/0253 (2013.01); B06B 3/00 (2013.01);
Abstract

According to one embodiment, an ultrasonic bonding apparatus includes an ultrasonic transducer, a distal-end tool, an ultrasonic horn and an ultrasonic oscillator. The ultrasonic oscillator includes an oscillation circuit and a control device. The ultrasonic oscillator applies the voltage oscillated by the oscillation circuit to the ultrasonic transducer. The control device is configured to detect a voltage reflection ratio from the voltage and current supplied from the oscillation circuit and to control the frequency of the voltage generated by the oscillation circuit, thereby to minimize the voltage reflection ratio.


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