The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2022
Filed:
Jun. 18, 2021
Applicant:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Inventors:
Takashi Ito, Fujisawa, JP;
Takahiro Aizawa, Yokohama, JP;
Masatoshi Tanabe, Yokohama, JP;
Haruka Yamamoto, Yokohama, JP;
Assignee:
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B29C 65/08 (2006.01); H01R 43/02 (2006.01);
U.S. Cl.
CPC ...
B29C 66/91231 (2013.01); B29C 65/08 (2013.01); B29C 66/9241 (2013.01); B29C 66/9516 (2013.01); H01R 43/0207 (2013.01);
Abstract
An ultrasonic bonding apparatus includes a temperature sensor that detects a temperature of a bonding target member arranged on an upper side of a stage. The ultrasonic bonding apparatus includes a control device that changes a control parameter associated with the driving of a bonding tool based on information related to the temperature detected by the temperature sensor.