The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2012
Filed:
Aug. 25, 2009
Akira Tojo, Kanagawa-ken, JP;
Tomoyuki Kitani, Kanagawa-ken, JP;
Tomohiro Iguchi, Kanagawa-ken, JP;
Takahiro Aizawa, Kanagawa-ken, JP;
Hideo Nishiuchi, Kanagawa-ken, JP;
Masako Fukumitsu, Kanagawa-ken, JP;
Akira Tojo, Kanagawa-ken, JP;
Tomoyuki Kitani, Kanagawa-ken, JP;
Tomohiro Iguchi, Kanagawa-ken, JP;
Takahiro Aizawa, Kanagawa-ken, JP;
Hideo Nishiuchi, Kanagawa-ken, JP;
Masako Fukumitsu, Kanagawa-ken, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
According to an aspect of the present invention, there is provided a semiconductor device, including a semiconductor chip including a semiconductor element, a first electrode of the semiconductor chip being configured on a first surface of the semiconductor element, a second electrode of the semiconductor element being configured on a second surface opposed to the first surface of the semiconductor chip, an encapsulating material encapsulating the semiconductor chip, a first hole and a second hole being configured in the encapsulating material, a portion of the first electrode and a portion of the second electrode being exposed, a first conductive material being connected to the first surface of the semiconductor chip via the first hole, a second conductive material being connected to the second surface of the semiconductor chip via the second hole, and a plating film covering five surfaces of the first conductive material other than one surface contacting with the encapsulating material and five surfaces of the second conductive material other than one surface contacting with the encapsulating material.