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For the Inventor, By the Inventor

Suwon, South Korea

Taeseong Kim

This inventor holds 18 USPTO granted patents and 7 published patent applications, primarily in Semiconductor Devices. Top assignees: Samsung Electronics Co., Ltd., Samsung Electronics Ltd.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Taeseong Kim. Retrieved from https://idiyas.com/inventor/taeseong-kim-hvb01qkl

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 94.4

Average Co-Inventor Count = 3.9

ph-index = 2

Forward Citations = 15(Granted Patents)


Location History:

  • Suwon-si, KR (2014 - 2024)
  • Hwaseong-si, KR (2024)

Company Filing History:

goldMedal17 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents
silverMedal1 out of 6,376 
 
Samsung Electronics Ltd.
 patents

Years Active: 2014-2026

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Areas of Expertise:
Semiconductor Device
Through Via
Bonding Enhancement
Penetration Vias
Integrated Circuit
Thermal Management
Data Storage System
Vertical Stacking
Semiconductor Package
Fabrication Methods
18 patents (USPTO):Explore Patents
1. 12593714 - Semiconductor device including bonding enhancement layer and method of forming the same (2026-03-31),
2. 12347781 - Semiconductor devices having penetration vias (2025-07-01),
3. 12166000 - Semiconductor device including a lower chip including a peripheral circuit and first and second memory chips vertically stacked thereon and data storage system including the same (2024-12-10),
4. 12107109 - Semiconductor device including through via, semiconductor package, and method of fabricating the same (2024-10-01),
5. 12046538 - Semiconductor device including through via structure (2024-07-23),
6. 11955408 - Integrated circuit semiconductor device including through silicon via (2024-04-09),
7. 11791211 - Semiconductor devices including through vias and methods of fabricating the same (2023-10-17),
8. 11749586 - Semiconductor device including through via structure (2023-09-05),
9. 11664316 - Semiconductor devices having penetration vias with portions having decreasing widths (2023-05-30),
10. 11626443 - Semiconductor device including through via, semiconductor package, and method of fabricating the same (2023-04-11),
11. 11373932 - Semiconductor packages including through holes and methods of fabricating the same (2022-06-28),
12. 11295981 - Semiconductor devices including through vias and methods of fabricating the same (2022-04-05),
13. 11133240 - Semiconductor device and semiconductor package (2021-09-28),
14. 10734430 - Semiconductor device including through via, semiconductor package, and method of fabricating the same (2020-08-04),
15. 9847276 - Semiconductor devices having through-electrodes and methods for fabricating the same (2017-12-19),

Title: Inventor Taeseong Kim: Revolutionizing Technology in Suwon-si, KR

Introduction: Taeseong Kim is a visionary inventor based in Suwon-si, South Korea, known for his groundbreaking contributions to the field of technology.

Latest Patents: Taeseong Kim holds several patents in the areas of artificial intelligence, robotics, and renewable energy, showcasing his innovative spirit and commitment to driving progress in these fields.

Career Highlights: With a career spanning over two decades, Taeseong Kim has worked with leading tech companies in South Korea, spearheading research and development projects that have led to significant technological advancements.

Collaborations: Throughout his career, Taeseong Kim has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing.

Conclusion: Taeseong Kim's passion for innovation and his relentless pursuit of technological excellence continue to inspire the next generation of inventors and shape the future of technology in Suwon-si and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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