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For the Inventor, By the Inventor

Cheonan, South Korea

Tae-Sung Yoon

This inventor holds 9 USPTO granted patents. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2005-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tae-Sung Yoon. Retrieved from https://idiyas.com/inventor/tae-sung-yoon-rnaf5tfc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 9

% Patents Active = 66.7

Average Co-Inventor Count = 1.5

ph-index = 5

Forward Citations = 76(Granted Patents)


Location History:

  • Cheonan, KR (2005)
  • Cheonan-si, KR (2008 - 2012)
  • Chungcheongnam-do, KR (2008 - 2012)

Company Filing History:

goldMedal9 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2005-2012

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9 patents (USPTO):Explore Patents
1. 8294250 - Wiring substrate for a semiconductor chip, and semiconducotor package having the wiring substrate (2012-10-23),
2. 8116088 - Semiconductor package and method of forming the same, and printed circuit board (2012-02-14),
3. 7732905 - Stack package and semiconductor module implementing the same (2010-06-08),
4. 7550830 - Stacked semiconductor package having fan-out structure through wire bonding (2009-06-23),
5. 7485959 - Structure for joining a semiconductor package to a substrate using a solder column (2009-02-03),
6. 7371618 - Method of manufacturing wafer-level chip-size package and molding apparatus used in the method (2008-05-13),
7. 7368821 - BGA semiconductor chip package and mounting structure thereof (2008-05-06),
8. 7327032 - Semiconductor package accomplishing fan-out structure through wire bonding (2008-02-05),
9. 6946328 - Method for manufacturing semiconductor devices (2005-09-20),

Title: Innovations of Tae-Sung Yoon

Introduction

Tae-Sung Yoon is a prominent inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work focuses on advancements in wiring substrates and semiconductor packages, which are crucial for modern electronic devices.

Latest Patents

Among his latest patents are a wiring substrate for a semiconductor chip and a semiconductor package that incorporates this wiring substrate. The wiring substrate features a multi-layered structure with first and second wiring layers, along with bonding pads arranged in a concavo-convex manner. This innovative design allows for efficient connectivity with semiconductor chips. Additionally, his semiconductor package includes a printed circuit board (PCB) that is divided by isolation regions, enhancing the performance and reliability of the semiconductor chips mounted on it.

Career Highlights

Tae-Sung Yoon is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has positioned him as a key player in the development of cutting-edge semiconductor technologies. His patents reflect his commitment to innovation and excellence in this rapidly evolving field.

Collaborations

Throughout his career, Tae-Sung Yoon has collaborated with talented individuals such as Jin-Ho Kim and Hee-Jin Park. These collaborations have contributed to the successful development of his patented technologies and have fostered a creative environment for innovation.

Conclusion

Tae-Sung Yoon's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a leading inventor in the industry. His innovative designs continue to shape the future of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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