The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2009
Filed:
Jan. 11, 2006
Cheol-joon Yoo, Chungcheongnam-do, KR;
Jin-ho Kim, Chungcheongnam-do, KR;
Hee-jin Park, Chungcheongnam-do, KR;
Tae-sung Yoon, Chungcheongnam-do, KR;
Chan-suk Lee, Chungcheongnam-do, KR;
Cheol-Joon Yoo, Chungcheongnam-do, KR;
Jin-Ho Kim, Chungcheongnam-do, KR;
Hee-Jin Park, Chungcheongnam-do, KR;
Tae-Sung Yoon, Chungcheongnam-do, KR;
Chan-Suk Lee, Chungcheongnam-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A semiconductor package and a package mounting substrate can be joined using a conductive material column. Each of the semiconductor package and the package mounting substrate include an insulating protective opening exposing a wiring layer therein. The solder column resides within the insulating protective openings to electrically couple the wiring layers. The insulating protective openings protect the solder column against stress faults to form reliable electrical connections and to support high-density electrical connections between the semiconductor package and the package mounting substrate.