The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2010
Filed:
Jan. 13, 2006
Applicant:
Tae-sung Yoon, Cheonan-si, KR;
Inventor:
Tae-Sung Yoon, Cheonan-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
The stack package may have a structure in which unit packages may be inserted into slots of a receiving substrate. The unit package may have a plurality of connecting pads. The receiving substrate may have substrate pads, which may be electrically connected to the connecting pads of the unit packages inserted in the slots by mechanical contact. The slots may be provided at regular vertical intervals so that the unit packages may be stacked in the vertical direction. A semiconductor module may include stack packages installed on at least one surface of a module substrate.