The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Oct. 08, 2010
Tae-sung Yoon, Cheonan-si, KR;
Tae-Sung Yoon, Cheonan-si, KR;
Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Abstract
A wiring substrate for a semiconductor chip includes a substrate, first and second wiring layers and a plurality of first and second bonding pads. The substrate has a first surface and a second surface opposite to the first surface, a window extending from the first surface to the second surface to expose chip pads of a semiconductor chip adherable to the first surface. The first and second wiring layers of a multi-layered structure are sequentially formed on the second surface of the substrate with at least one insulation layer interposed between the first and second wiring layers. A plurality of the first and second bonding pads are respectively connected to the first and second wiring layers, the first and second bonding pads having a concavo-convex arrangement on the second surface of the substrate along a side of the window.