Tadahiro Kuroda

USPTO Granted Patents = 68 (Patent Applications = 7)

EPO Patents = 1 (Patent Applications = 2)

Average Co-Inventor Count = 1.4

ph-index = 13

Forward Citations = 475(Granted Patents)

Forward Citations (Not Self Cited) = 460(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Kawasaki, JP (1993 - 1995)
Koto-Ku, JP (2000)
Sumida-Ku, JP (2001)
Ichikawa, JP (1997 - 2002)
Tokyo-To, JP (2002)
Tokyo, JP (2011 - 2012)
Kanagawa, JP (2011 - 2018)
Yokohama, JP (1997 - 2024)

Company Filing History:

34 out of 52,752

Kabushiki Kaisha Toshiba

Synergy Semiconductor Corporation

patents

6. 1 out of 7,529

Renesas Electronics Corporation

Semiconductor Technology Academic Research Center

patents

where one patent can have more than one assignee

Years Active: 1993-2024

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Areas of Expertise:

Transmission Antenna Module

Non-Contact Communication

Inductive Coupling

Multilayer Semiconductor

Directional Coupling

Integrated Circuit Devices

Electronic Circuit Testing

Ultra-Wideband Receiver

Semiconductor Manufacturing

Signal Transmission Systems

Power Consumption Reduction

CMOS Technology

68 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11956028 - Transmission antenna module, non-contact transmission module, non-contact communication system provided therewith and non-contact communication method (2024-04-09),

2. 11349522 - Communication circuit and communication meihod (2022-05-31),

3. 10992349 - Transmission antenna module, non-contact transmission module, non-contact communication system provided therewith and non-contact communication method (2021-04-27),

4. 10666324 - Rotation information transmission apparatus (2020-05-26),

5. 10348365 - Directional coupling communication apparatus (2019-07-09),

6. 10291290 - Directional coupling communication apparatus (2019-05-14),

7. 9979441 - Inductive relayed coupling circuit between substrates (2018-05-22),

8. 9978717 - Multilayer semiconductor integrated circuit device (2018-05-22),

9. 9864143 - Directional coupling-type multi-drop bus (2018-01-09),

10. 9847305 - Semiconductor chip with multilayer solenoid coil and multi-chip module comprising the same (2017-12-19),

11. 9843363 - Covered wire coupling type information communication network, electromagnetic field coupling communication method and electromagnetic field coupler (2017-12-12),

12. 9749020 - Integrated circuit and layered circuit provided therewith (2017-08-29),

13. 9716306 - Directional coupler and communication device including same (2017-07-25),

14. 9419684 - Inter-module communication apparatus (2016-08-16),

15. 9053950 - Electronic circuit (2015-06-09),

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7 patents pending:

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1 patent (EPO):

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2 patents pending (EPO):

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