Kabushiki Kaisha Toshiba

Keio University

Thruchip Japan Inc.

Hosiden Corporation

Nec Corporation

Renesas Electronics Corporation

Semiconductor Technology Academic Research Center

Synergy Semiconductor Corporation

Tadahiro Kuroda

Mototsugu Hamada

Takayasu Sakurai

Daisuke Mizoguchi

Tetsuya Fujita

Kazuhiko Kasai

Tetsu Nagamatsu

Makoto Noda

Hiroki Ishikuro

Noriyuki Miura

Hayato Kondo

Kosuke Sasada

Shinji Fujii

Masahiro Kimura

Toshiyuki Fukunaga

Shinji Mita

Hiroaki Suzuki

Yoshihiro Nakagawa

Masataka Matsui

Shouhei Kousai

Toshinari Takayanagi

Kenji Matsuo

Shunichi Iwata

Muneo Fukaishi

Kojiro Suzuki

Fumiyuki Yamane

Yutaka Takikawa

Yasuo Unekawa

David A Gray

Gensoh Matsubara

Ayako Hirata

Yoshihiro Shimizu

Takahide Terada

Yoichi Takahata

Toshihiko Sugahara

Takashi Moriizumi

Shingo Yoshizumi

Yusmeeraz Binti Yusof

Noriyuki Mirua

A module and system are provided for reducing or suppressing ringing occurring in a digital signal to be transmitted. A transmission module Ma includes a transmitterconfigured to transmit a digital signal, a transmission antennaconstituted by a metal plate, or by a conductor formed on an insulator, the transmission antennabeing configured to be electromagnetically or magnetically coupled to a reception antennaof a non-contact reception module Mb for digital communication, and a resistorconnected in series between the transmitterand the transmission antenna. The resistorhas such a resistance value that the resistorentirely blunts a waveform of the digital signal outputted from the transmitterso as to reduce or suppress ringing occurring in the digital signal. The blunted digital signal is to be inputted into the transmission antenna

Transmission antenna module, non-contact transmission module, non-contact communication system provided therewith and non-contact communication method

A communication circuit including a first coupler, a transmission-data change detector configured to detect a change in transmission data input to a transmitter, and a received-data change detector configured to detect a change in received data output from a receiver. In a standby state in which the received-data change detector and the transmission-data change detector do not detect changes in the received data and the transmission data, an input side of the receiver is connected to the first coupler and an output side of the receiver is disconnected from the first port in a receiving path; and an input side of the transmitter is connected to the first port and an output side of the transmitter is disconnected from the first coupler in a transmitting path.

Communication circuit and communication meihod

Ringing occurring in a digital signal to be transmitted, is reduced or suppressed. A transmission module Ma includes a transmitterconfigured to transmit a digital signal, a transmission antennaconstituted by a metal plate, or by a conductor formed on an insulator. The transmission antennais configured to be electromagnetically or magnetically coupled to a reception antennaof a non-contact reception module Mb for digital communication. A resistoris connected in series between the transmitterand the transmission antenna. The resistorhas such a resistance value that the resistorentirely blunts a waveform of the digital signal outputted from the transmitterso as to reduce or suppress ringing occurring in the digital signal. The blunted digital signal can be inputted into the transmission antenna

The invention relates to a rotation information transmission apparatus where wireless communication of data of several Gbps is made possible without miniaturizing the coupler to such an extent that installation is difficult. A first substrate where a first coupler in arc form is provided in an upper portion or a lower portion and a second substrate where a second coupler in arc form of which the length of the arc is shorter than that of the first coupler in arc form is arranged in a location where coupling with the first coupler in arc form is possible are arranged so as to rotate relative to each other by fixing either the first substrate or the second substrate to a non-movable portion and fixing the other of the first substrate or the second substrate to a rotational member.

Rotation information transmission apparatus

The invention relates to a directional coupling communication apparatus where the coupling impedance can be easily matched to reduce reflections, and thus, the speed of communication channels is increased as compared to that with inductive coupling, and at the same time, the reliability of communication is improved by increasing the signal intensity. Modules having a coupler where an input/output connection line is connected to a first end, and either a ground line or an input/output connection line to which an inverse signal of a signal to be inputted into the input/output connection line connected to the above-described first end is inputted is connected are layered on top of each other so that the couplers are couplers to each other using capacitive coupling and inductive coupling.

Directional coupling communication apparatus

An electronic circuit carries out communication by inductive coupling between chips which are stacked and mounted. The electronic circuit relays an inter-chip communication signal by a repeater which receives a signal from a transmitter to recognize a transmission source and a receiving destination, and relays a received signal when the repeater itself exists between the transmission source and the receiving destination, and does not relay the received signal when the repeater itself does not exist between the transmission source and the receiving destination. Accordingly, data can be transferred at high speed up to a chip farther than the dimensions of a coil through communications by inductive coupling between the stacked and mounted chips.

Inductive relayed coupling circuit between substrates

The invention relates to a multilayer semiconductor integrated circuit device which is provided with a smaller space for a three-dimensional multilayer configuration at a lower cost and with a sufficient power supply quality. A first semiconductor integrated circuit device is provided with a first penetrating semiconductor region that penetrates through the first semiconductor body in the thickness direction and that is connected to the first power supply potential, and a second penetrating semiconductor region that penetrates through the first semiconductor body in the thickness direction and that is connected to the second power supply potential. A second semiconductor integrated circuit device having a first electrode and a second electrode is layered on top of the first semiconductor integrated circuit device so that the first electrode and the second electrode are respectively connected to the first penetrating semiconductor region and the second penetrating semiconductor region.

Multilayer semiconductor integrated circuit device

The invention relates to a directional coupling-type multi-drop bus of which the impedance is matched with the bus at the time of coupling so that the speed is increased. A directional coupler is formed when a second module provided with a second coupler end is mounted on a first module provided with a first coupler end, and as a result, the coupling impedance where the proximity effects in the coupling state of the directional coupler are reflected is matched with the impedance of the bus.

Directional coupling-type multi-drop bus

In accordance with the disclosed semiconductor chip and multi-chip module, signal transmission is made possible between semiconductor chips that are placed on a plane so as to be adjacent to each other through inductive coupling without affecting other coils such as in an oscillation circuit or an antenna circuit for RF communication. A multilayer solenoid coil, where a plane of the coil formed in a multilayer wiring structure in a semiconductor body is parallel to a main surface of the semiconductor body, is formed along at least one side end surface of the semiconductor body.

Semiconductor chip with multilayer solenoid coil and multi-chip module comprising the same

This invention relates to a covered wire coupling type information communication network, an electromagnetic field coupling communication method and an electromagnetic field coupler, which makes it possible to solve the problem with the mechanical contact system and the structure where wires are exposed in a connector. A first covered wire and a second covered wire are placed in close proximity to each other in a coupling unit, and electromagnetic coupling in the coupling unit creates a data connection between the first and second covered wire.

Covered wire coupling type information communication network, electromagnetic field coupling communication method and electromagnetic field coupler

An integrated circuit includes multiple quadrangular coils including a first wiring and a second wiring that are alternately connected to each other and formed on different layers in a manner perpendicularly intersecting each other. The coils are partly overlapped with each other in a diagonal direction that connects opposite corners of the coils. The coils preferably have the same structures. A target coil among the coils preferably partly overlaps with another coil among the coils in two diagonal directions that connect opposite corners of the target coil.

Integrated circuit and layered circuit provided therewith

A directional coupler including a first transmission line including a terminal part provided with a matched termination, and a front end part being an end portion on a side opposite to a side of the terminal part; a second transmission line electromagnetically coupled with the first transmission line; and a third transmission line electromagnetically coupled with the first transmission line, wherein each of the second and third transmission lines includes a near end and a far end, the near end being positioned on a side closer to the front end part when tracing the first transmission line from the front end part, the far end being positioned on a side farther from the front end part when tracing the first transmission line from the front end part, and wherein the near end is terminated to have an impedance smaller than a characteristic impedance of the second transmission line.

Directional coupler and communication device including same

The invention relates to an inter-module communication apparatus where the reflection is reduced so that the communication channel can provide high speed and broadband as compared to inductive coupling. When modules having a signal line terminated with a terminating member and a feedback signal line are layered on top of each other so that the signal lines are coupled to each other and the return signal lines are coupled to each other using capacitive coupling and inductive coupling, the impedance of the terminating members is a coupling impedance that reflects the proximity effects in the coupling state between the modules.

Inter-module communication apparatus

By stacking and mounting a second substratehaving the same structure as that of a first substrateon the first substrate upon rotating the second substrate by 180 degrees and sliding the second substrate, an antennaand an antennaoverlap each other and an antennaand an antennaoverlap each other and communications in each of these combinations are enabled, and a space for wire bondingsis secured. Accordingly, communications between the substrates are made via the antennas, and further, a space for wire bondings is secured on each substrate, wireless communications are carried out between substrates which have the same basic structure and are stacked and mounted, and power can be supplied via the wire bondings.

Electronic circuit

Growing community of inventors

Yokohama, Japan

Tadahiro Kuroda