The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Nov. 20, 2008
Applicant:

Tadahiro Kuroda, Kanagawa, JP;

Inventor:

Tadahiro Kuroda, Kanagawa, JP;

Assignee:

Keio University, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04B 5/00 (2006.01); H04B 7/00 (2006.01); H01L 25/065 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/30107 (2013.01); H01Q 1/2283 (2013.01); H01L 2224/32145 (2013.01); H01L 2924/01019 (2013.01);
Abstract

By stacking and mounting a second substratehaving the same structure as that of a first substrateon the first substrate upon rotating the second substrate by 180 degrees and sliding the second substrate, an antennaand an antennaoverlap each other and an antennaand an antennaoverlap each other and communications in each of these combinations are enabled, and a space for wire bondingsis secured. Accordingly, communications between the substrates are made via the antennas, and further, a space for wire bondings is secured on each substrate, wireless communications are carried out between substrates which have the same basic structure and are stacked and mounted, and power can be supplied via the wire bondings.


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