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For the Inventor, By the Inventor

Tokyo, Japan

Thruchip Japan Inc.


USPTO Granted Patents = 3


Forward Citations = 1

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1 inventor (with patents filed for the assignee):

goldMedal Tadahiro Kuroda (3 out of 68 patents)


3 patents:

1. 9979441 - Inductive relayed coupling circuit between substrates (2018-05-22),
2. 9978717 - Multilayer semiconductor integrated circuit device (2018-05-22),
3. 9749020 - Integrated circuit and layered circuit provided therewith (2017-08-29),
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USPTO Data Jan 1 1976 - Jan 20 2026

3 Patents

#3,265 in Tokyo

#8,770 in Japan

...
Tokyo, Japan

Thruchip Japan Inc.

Forward Citations = 1

1 inventor:

goldMedal Tadahiro Kuroda (3 out of 68 patents)

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