The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Jun. 01, 2009
Applicant:

Tadahiro Kuroda, Kanagawa, JP;

Inventor:

Tadahiro Kuroda, Kanagawa, JP;

Assignee:

THRUCHIP JAPAN INC., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 5/00 (2006.01); H04B 5/02 (2006.01); H02J 50/10 (2016.01); H01L 23/48 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H04B 5/02 (2013.01); H01L 23/48 (2013.01); H01L 23/5227 (2013.01); H01L 24/06 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 25/0657 (2013.01); H02J 50/10 (2016.02); H04B 5/0093 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/4911 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85399 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/30107 (2013.01);
Abstract

An electronic circuit carries out communication by inductive coupling between chips which are stacked and mounted. The electronic circuit relays an inter-chip communication signal by a repeater which receives a signal from a transmitter to recognize a transmission source and a receiving destination, and relays a received signal when the repeater itself exists between the transmission source and the receiving destination, and does not relay the received signal when the repeater itself does not exist between the transmission source and the receiving destination. Accordingly, data can be transferred at high speed up to a chip farther than the dimensions of a coil through communications by inductive coupling between the stacked and mounted chips.


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