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Tadahiro Kato

This inventor holds 31 USPTO granted patents and 1 published patent application and 4 EPO patents, primarily in Semiconductor Wafer Processing. Top assignees: Shin-Etsu Handotai Co., Ltd., Other. Active years: 1995-2018.

USPTO Granted Patents = 31 (Patent Applications = 1)

% Patents Active = 83.9

EPO Patents = 4

Average Co-Inventor Count = 2.4

ph-index = 11

Forward Citations = 372(Granted Patents)

Location History:

Nishigou-mura, JP (1999)
Shirakawa, JP (1998 - 2000)
Nishigo, JP (1996 - 2001)
Fukushima-ken, JP (1997 - 2002)
Nishishirakawa-gun, JP (2001 - 2004)
Nishishirakawa, JP (2011 - 2013)
Nishihirakawa, JP (2013)
Fukushima, JP (1995 - 2016)
Annaka, JP (2018)

Company Filing History:

30 out of 1,099

Shin-Etsu Handotai Co., Ltd.

patents

1 out of 834,411

Other

patents

Years Active: 1995-2018

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Areas of Expertise:

Wafer Production

Semiconductor Wafer

Surface Grinding

Double-Disc Grinding

Chamfering Apparatus

Nanotopography Improvement

Bonded Wafer Manufacturing

Wire Saw Method

Etching Techniques

Thin Plate Work

Polishing Methods

Manufacturing Process

31 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10011046 - Fixed-abrasive-grain wire, wire saw, and method for slicing workpiece (2018-07-03),

2. 10002753 - Chamfering apparatus and method for manufacturing notchless wafer (2018-06-19),

3. 9358655 - Outer periphery polishing apparatus for disc-shaped workpiece (2016-06-07),

4. 8603897 - Method for manufacturing bonded wafer (2013-12-10),

5. 8562390 - Double-disc grinding apparatus and method for producing wafer (2013-10-22),

6. 8454852 - Chamfering apparatus for silicon wafer, method for producing silicon wafer, and etched silicon wafer (2013-06-04),

7. 8231430 - Wafer production method (2012-07-31),

8. 8037878 - Method for slicing workpiece by using wire saw and wire saw (2011-10-18),

9. 8029339 - Workpiece double-disc grinding apparatus and workpiece double-disc grinding method (2011-10-04),

10. 7997262 - Method of improving nanotopography of surface of wafer and wire saw apparatus (2011-08-16),

11. 7507146 - Method for producing semiconductor wafer and semiconductor wafer (2009-03-24),

12. 7332437 - Method for processing semiconductor wafer and semiconductor wafer (2008-02-19),

13. 6787797 - Semiconductor wafer and device for semiconductor device manufacturing process (2004-09-07),

14. 6726525 - Method and device for grinding double sides of thin disk work (2004-04-27),

15. 6652358 - Double-sided simultaneous grinding method, double-sided simultaneous grinding machine, double-sided simultaneous lapping method, and double-sided simultaneous lapping machine (2003-11-25),

Title: Tadahiro Kato: Pioneering Inventor from Fukushima

Introduction: Tadahiro Kato is a renowned inventor hailing from Fukushima, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kato's latest patents include advancements in robotics, artificial intelligence, and renewable energy technologies, showcasing his commitment to pushing the boundaries of scientific discovery.

Career Highlights: With a career spanning over two decades, Kato has established himself as a leading figure in the world of inventors, with numerous accolades recognizing his innovative spirit and dedication to creating solutions for complex challenges.

Collaborations: Throughout his career, Kato has collaborated with top research institutions, universities, and tech companies to bring his inventions to life, fostering a culture of creativity and excellence in the industry.

Conclusion: Tadahiro Kato's relentless pursuit of innovation and his passion for creating a better future through technology make him a true visionary in the world of inventors.

Profile summary based on public USPTO records.

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