The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2011

Filed:

Nov. 17, 2008
Applicants:

Koji Kitagawa, Nishishirakawa, JP;

Tadahiro Kato, Nishishirakawa, JP;

Yukio Itoi, Nishishirakawa, JP;

Tomiichi Sudou, Nishishirakawa, JP;

Inventors:

Koji Kitagawa, Nishishirakawa, JP;

Tadahiro Kato, Nishishirakawa, JP;

Yukio Itoi, Nishishirakawa, JP;

Tomiichi Sudou, Nishishirakawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28D 1/06 (2006.01); B24B 49/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention is a wire saw in which a wire for slicing is wound around a plurality of rollers to form a wire row; the wire for slicing is driven axially in a reciprocating direction; a workpiece is sliced simultaneously at a plurality of points arranged in an axial direction by feeding the workpiece against the wire row with the workpiece cut into while a slurry is supplied to the wire for slicing; the wire saw controlling in such a manner that the workpiece is extracted while the wire is caused to travel at a speed of 2 m/min or less at the time of extracting the workpiece from the wire row after slicing the workpiece. As a result, there is provided a wire saw in which the workpiece sliced with the wire row of the wire saw can be extracted from the wire row with a simple structure without a negative influence on its slicing surface.


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