Patterson, NY, United States of America

Steven E Molis

USPTO Granted Patents = 16 

Average Co-Inventor Count = 6.4

ph-index = 9

Forward Citations = 182(Granted Patents)


Location History:

  • Brewster, NY (US) (1995 - 1997)
  • Yorktown Heights, NY (US) (1989 - 2009)
  • Patterson, NY (US) (2009 - 2015)

Company Filing History:


Years Active: 1989-2015

where 'Filed Patents' based on already Granted Patents

16 patents (USPTO):

Sure, I can help with that. Here's the article about the inventor Steven E Molis:

Title: Innovator Spotlight: Steven E Molis - Pioneering Patents in 3-D Fabrication and Interconnect Structures

Introduction:

Steven E Molis, a talented inventor based in Patterson, NY, has made significant contributions to the field of technology with an impressive portfolio of 16 patents. His latest innovations focus on enhancing 3-D fabrication processes and improving interconnect structures.

Latest Patents:

1. Releasable buried layer for 3-D fabrication and methods of manufacturing: Molis introduced a cutting-edge method for 3-D fabrication, involving a carbon-rich dielectric releasable layer and advanced manufacturing techniques.

2. Enhanced diffusion barrier for interconnect structures: Molis developed alternative methods for fabricating interconnect structures, featuring in-situ formed metal nitride liners for enhanced performance.

Career Highlights:

Throughout his career, Steven E Molis has honed his skills and expertise while working with reputable companies such as IBM (International Business Machines Corporation) and Applied Materials, Inc. His tenure at these industry giants has provided him with invaluable experience and resources to drive forward his innovative projects.

Collaborations:

Molis has collaborated with esteemed professionals in the field, including coworkers Jane M Shaw and Ali Afzali-ardakani. Together, they have synergized their efforts to push the boundaries of technology and bring groundbreaking inventions to fruition.

Conclusion:

Steven E Molis stands as a beacon of innovation in the technological landscape, with a remarkable track record of patents that showcase his creativity and ingenuity. His relentless pursuit of excellence continues to inspire and shape the future of 3-D fabrication and interconnect structures.

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