Portland, OR, United States of America

Sridhar Balakrishnan

USPTO Granted Patents = 17 

Average Co-Inventor Count = 3.1

ph-index = 7

Forward Citations = 175(Granted Patents)


Location History:

  • Rio Rancho, NM (US) (2013)
  • Portland, OR (US) (1992 - 2021)

Company Filing History:


Years Active: 1992-2021

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17 patents (USPTO):Explore Patents

Title: Innovations of Sridhar Balakrishnan

Introduction

Sridhar Balakrishnan is a prominent inventor based in Portland, OR (US). He has made significant contributions to the field of semiconductor packaging, holding a total of 17 patents. His work focuses on enhancing the efficiency and reliability of die packaging technologies.

Latest Patents

One of his latest patents involves designs and methods for conductive bumps, specifically addressing methods, techniques, and structures related to die packaging. In this exemplary implementation, a die package interconnect structure includes a semiconductor substrate and a first conducting layer in contact with the semiconductor substrate. The first conducting layer may include a base layer metal, which can be copper (Cu). The implementation also includes a diffusion barrier in contact with the first conducting layer and a wetting layer on top of the diffusion barrier. A bump layer resides on top of the wetting layer, which may include tin (Sn) that is electroplated. The diffusion barrier is electroless and is designed to prevent Cu and Sn from diffusing through it. Additionally, the diffusion barrier is adapted to suppress whisker-type formation in the bump layer.

Career Highlights

Sridhar Balakrishnan is currently employed at Intel Corporation, where he continues to innovate in the semiconductor industry. His extensive experience and expertise have positioned him as a key player in the development of advanced packaging solutions.

Collaborations

Throughout his career, Sridhar has collaborated with notable colleagues, including Valery M Dubin and Mark T Bohr. These collaborations have further enriched his work and contributed to the advancement of semiconductor technologies.

Conclusion

Sridhar Balakrishnan's contributions to the field of semiconductor packaging through his innovative patents and collaborations highlight his significant role in advancing technology. His work continues to influence the industry and pave the way for future innovations.

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