Hsinchu, Taiwan

Shou-Yi Wang

USPTO Granted Patents = 13 

Average Co-Inventor Count = 3.7

ph-index = 3

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 2015-2025

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13 patents (USPTO):

Title: **Innovative Contributions of Shou-Yi Wang in Semiconductor Packaging**

Introduction

Shou-Yi Wang, an accomplished inventor based in Hsinchu, Taiwan, has made significant strides in the field of semiconductor packaging. With a total of 13 patents to his name, Wang's innovations play a crucial role in enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

Wang's recent patents include advancements in package structure and redistribution layer (RDL) technology. His patent titled "Package structure, RDL structure comprising redistribution layer having ground plates and signal lines" provides a detailed composition of a package structure featuring a die electrically connected to an RDL structure. This innovative RDL structure consists of three redistribution layers, with the first layer incorporating a ground plate and the second layer housing a signal trace. These modifications allow for improved electrical connectivity and spatial arrangement of components.

Another key patent, "Semiconductor package and manufacturing method thereof," describes a semiconductor package that has separate dies with die I/Os at their active sides. This package includes a redistribution structure that connects to the die I/Os, featuring multiple routing layers to efficiently manage signal lines and ground connections. These patents are a testament to Wang's focus on improving semiconductor technology for enhanced performance and reliability.

Career Highlights

Shou-Yi Wang is currently associated with Taiwan Semiconductor Manufacturing Company Ltd., where he contributes his expertise in semiconductor technologies. His role in this esteemed organization highlights his commitment to pushing the boundaries of innovation in the industry. Wang's extensive knowledge and experience have positioned him as a leading figure in advancing semiconductor packaging solutions.

Collaborations

Throughout his career, Wang has collaborated with several talented individuals, including colleagues Chien-Hsun Chen and Jiun Yi Wu. These collaborations have enabled him to engage in innovative projects that further enhance semiconductor technology. Working alongside other experts allows for the exchange of ideas and techniques, leading to groundbreaking inventions in the field.

Conclusion

Shou-Yi Wang’s inventive spirit and contributions to semiconductor packaging exemplify the impact of innovation on modern technology. With a portfolio of patents that reflect his expertise and collaborative efforts, Wang continues to shape the future of semiconductor design and functionality. His work not only advances the industry but also inspires the next generation of inventors and engineers.

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