The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
Jan. 14, 2011
Applicants:
Wen-yi Lin, Wugu Township, TW;
Po-yao Lin, Zhudong Township, TW;
Tsung-shu Lin, Yonghe, TW;
Kuo-chin Chang, Hsin-Chu, TW;
Shou-yi Wang, Hsin-Chu, TW;
Inventors:
Wen-Yi Lin, Wugu Township, TW;
Po-Yao Lin, Zhudong Township, TW;
Tsung-Shu Lin, Yonghe, TW;
Kuo-Chin Chang, Hsin-Chu, TW;
Shou-Yi Wang, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/16 (2006.01); H01L 23/055 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/16 (2013.01); H01L 23/055 (2013.01); H01L 23/562 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3511 (2013.01);
Abstract
In a package structure, a stiffener ring is over and bonded to a top surface of a first package component. A second package component is over and bonded to the top surface of the first package component, and is encircled by the stiffener ring. A metal lid is over and bonded to the stiffener ring. The metal lid has a through-opening.