The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2021
Filed:
Jun. 14, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A package structure, a RDL structure and method of forming the same are provided. The package structure includes a die structure, a RDL structure and a conductive terminal. The RDL structure is electrically connected to the die structure. The conductive terminal is electrically connected to the die structure through the RDL structure. The RDL structure includes a first redistribution layer and a second redistribution layer over the first redistribution layer. The first redistribution layer includes a ground plate. The second redistribution layer includes a signal line, and the signal line includes a signal via and a signal trace, the signal trace is electrically connected to the first redistribution layer through the signal via, and an overlapping area between the signal trace and the ground plate in a direction perpendicular to a bottom surface of the signal trace is less than an area of the bottom surface of the signal trace.