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For the Inventor, By the Inventor

Zhutian, Taiwan

Chien-Hsun Chen

This inventor holds 31 USPTO granted patents and 12 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chien-Hsun Chen. Retrieved from https://idiyas.com/inventor/chien-hsun-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 31 

% Patents Active = 93.5

Average Co-Inventor Count = 4.4

ph-index = 4

Forward Citations = 40(Granted Patents)


Location History:

  • Hsinchu, TW (2013 - 2014)
  • Zhutian Township, TW (2020 - 2024)
  • Pingtung County, TW (2021 - 2024)

Company Filing History:

goldMedal31 out of 43,553 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2025

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Areas of Expertise:
Semiconductor Package
Manufacturing Method
Integrated Circuit
Connection Structures
Redistribution Layer
Dielectric Slots
Embedded Voltage Regulator
Hybrid Dielectric Scheme
Mask Process Monitoring
Direct-Write Pattern
31 patents (USPTO):Explore Patents
1. 12489062 - Semiconductor package and manufacturing method thereof (2025-12-02),
2. 12469812 - Method for manufacturing semiconductor package with connection structures including via groups (2025-11-11),
3. 12418982 - Laminated structure with pads and manufacturing method thereof (2025-09-16),
4. 12406941 - Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same (2025-09-02),
5. 12354924 - Integrated circuit package and method (2025-07-08),
6. 12249564 - Package structure, RDL structure comprising redistribution layer having ground plates and signal lines (2025-03-11),
7. 12191251 - Semiconductor device and method of manufacture (2025-01-07),
8. 12183682 - Semiconductor package and manufacturing method thereof (2024-12-31),
9. 12080563 - Semiconductor devices and methods of manufacturing (2024-09-03),
10. 11984375 - Integrated circuit package and method (2024-05-14),
11. 11961814 - Integrated circuit package and method (2024-04-16),
12. 11923315 - Semiconductor package and manufacturing method thereof (2024-03-05),
13. 11715686 - Semiconductor device and method of manufacture (2023-08-01),
14. 11670575 - Package structure, RDL structure comprising redistribution layer having ground plates and signal lines (2023-06-06),
15. 11658085 - Integrated circuit package and method (2023-05-23),

Title: The Innovative Journey of Chien-Hsun Chen

Introduction:

Chien-Hsun Chen, a talented inventor hailing from Zhutian, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations and patents.

Latest Patents:

Chen's latest patents include cutting-edge advancements in the fields of artificial intelligence, renewable energy, and biotechnology, showcasing his versatility and forward-thinking approach to invention.

Career Highlights:

With a career spanning over two decades, Chien-Hsun Chen has established himself as a pioneer in the tech industry, holding numerous patents that have revolutionized various sectors. His dedication to pushing the boundaries of innovation has earned him recognition as a leading figure in the field.

Collaborations:

Throughout his career, Chen has collaborated with top research institutions, universities, and tech companies to bring his inventions to life. His ability to work seamlessly in multidisciplinary teams has led to the successful development of groundbreaking technologies.

Conclusion:

In conclusion, Chien-Hsun Chen's passion for innovation, coupled with his technical expertise, has solidified his position as a prominent inventor in the global tech landscape. His relentless pursuit of excellence continues to inspire future generations of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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