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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12796512 B1

PDFFull Text
Date of Patent:
Nov. 10, 2026

Filed:

Dec. 06, 2021

Hybrid dielectric scheme in packages

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chien-Hsun Chen, Zhutian Township, TW;

Jiun Yi Wu, Zhongli City, TW;

Chen-Hua Yu, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Timothy J Thompson

Assistant Examiner:

Sidi M Maiga

Int. Cl.
CPC ...
H10W 70/68 (2026.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H10W 20/20 (2026.01); H10W 44/20 (2026.01); H10W 70/05 (2026.01); H10W 70/65 (2026.01); H10W 70/685 (2026.01); H10W 70/69 (2026.01); H10W 90/00 (2026.01); H10W 99/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/685 (2026.01); H05K 1/0218 (2013.01); H05K 1/0245 (2013.01); H05K 1/115 (2013.01); H05K 3/4038 (2013.01); H10W 20/20 (2026.01); H10W 44/20 (2026.01); H10W 70/05 (2026.01); H10W 70/093 (2026.01); H10W 70/65 (2026.01); H10W 70/69 (2026.01); H10W 90/401 (2026.01); H10W 99/00 (2026.01); H10W 44/223 (2026.01);
Abstract

A method includes forming a first redistribution line, forming a polymer layer including a first portion encircling the first redistribution line and a second portion overlapping the first redistribution line, forming a pair of differential transmission lines over and contacting the polymer layer, and molding the pair of differential transmission lines in a molding compound. The molding compound includes a first portion encircling the pair of differential transmission lines, and a second portion overlapping the pair of differential transmission lines. An electrical connector is formed over and electrically coupling to the pair of differential transmission lines.

Find Patent Forward Citations

Quick Actions:

Chen, Chien-Hsun. (2026). Hybrid dielectric scheme in packages (U.S. Patent No. 12796512). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12796512

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