Shingo Yorisaki

Title: Shingo Yorisaki: Innovator in Semiconductor Technology

Introduction

Shingo Yorisaki is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His innovative work has advanced the manufacturing methods of semiconductor integrated circuit devices.

Latest Patents

Yorisaki's latest patents include a manufacturing method of semiconductor integrated circuit devices. This method allows a probe to contact a test pad without damaging the circuit formed in the chip during a probe test. The design incorporates a load jig, a pressing tool, an elastomer, an adhesion ring, and a plunger, all fixed together with a nut and bolt. The elastic force of a spring between the spring retaining jig and the load jig ensures that the components can be depressed toward the pad. Additionally, he has developed a fabrication method for semiconductor integrated circuit devices that enables electrical testing of devices with test pads at narrow pitches. This involves forming probes in a pyramid or trapezoidal pyramid shape from metal films, which are created by stacking rhodium and nickel films.

Career Highlights

Throughout his career, Shingo Yorisaki has worked with notable companies such as Renesas Technology Corporation and Renesas Electronics Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Yorisaki has collaborated with esteemed colleagues, including Akio Hasebe and Yasuhiro Motoyama. Their combined expertise has fostered innovation and development in their respective fields.

Conclusion

Shingo Yorisaki's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the future of semiconductor manufacturing and testing methods.