The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2009
Filed:
Nov. 18, 2004
Hideyuki Matsumoto, Tokyo, JP;
Shingo Yorisaki, Tokyo, JP;
Akio Hasebe, Tokyo, JP;
Yasuhiro Motoyama, Tokyo, JP;
Masayoshi Okamoto, Hitachinaka, JP;
Yasunori Narizuka, Yokohama, JP;
Hideyuki Matsumoto, Tokyo, JP;
Shingo Yorisaki, Tokyo, JP;
Akio Hasebe, Tokyo, JP;
Yasuhiro Motoyama, Tokyo, JP;
Masayoshi Okamoto, Hitachinaka, JP;
Yasunori Narizuka, Yokohama, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
As the thickness of the card holder for preventing warping of a multilayered wiring substrateis increased, there occurs a problem that a thin film sheetis buried in a card holder and secure contact between probesand test pads cannot be realized. For its prevention, the thin film sheetand a bonding ringare bonded in a state where a tensile force is applied only to the central region IA of the thin film sheet, and a tensile force is not applied to an outer peripheral region OA. Then, the height of the bonding ringdefining the height up to the probe surface of the thin film sheetis increased, thereby increasing the height up to the probe surface of the thin film sheet