The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2011
Filed:
Aug. 10, 2010
Masayoshi Okamoto, Ryuou, JP;
Yoshiaki Hasegawa, Maebashi, JP;
Yasuhiro Motoyama, Hachioji, JP;
Hideyuki Matsumoto, Higashimurayama, JP;
Shingo Yorisaki, Hachioji, JP;
Akio Hasebe, Kodaira, JP;
Ryuji Shibata, Higashiyamato, JP;
Yasunori Narizuka, Hiratsuka, JP;
Akira Yabushita, Yokohama, JP;
Toshiyuki Majima, Yokohama, JP;
Masayoshi Okamoto, Ryuou, JP;
Yoshiaki Hasegawa, Maebashi, JP;
Yasuhiro Motoyama, Hachioji, JP;
Hideyuki Matsumoto, Higashimurayama, JP;
Shingo Yorisaki, Hachioji, JP;
Akio Hasebe, Kodaira, JP;
Ryuji Shibata, Higashiyamato, JP;
Yasunori Narizuka, Hiratsuka, JP;
Akira Yabushita, Yokohama, JP;
Toshiyuki Majima, Yokohama, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.