The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2008
Filed:
Jun. 21, 2006
Akio Hasebe, Tokyo, JP;
Masayoshi Okamoto, Tokyo, JP;
Yasunori Narizuka, Tokyo, JP;
Shingo Yorisaki, Tokyo, JP;
Yasuhiro Motoyama, Tokyo, JP;
Akio Hasebe, Tokyo, JP;
Masayoshi Okamoto, Tokyo, JP;
Yasunori Narizuka, Tokyo, JP;
Shingo Yorisaki, Tokyo, JP;
Yasuhiro Motoyama, Tokyo, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
During probe testing using a prober having probe needles formed by using a manufacturing technology for a semiconductor integrated circuit device, reliable contact is ensured between the probe needles and test pads. A pressing tool having at least one hole portion formed therein and extending therethrough between the main and back surface thereof is prepared. An elastomer in the form of a sheet and a polyimide sheet are successively disposed on the main surface of the pressing tool. With th elastomer and the polyimide sheet being electrostatically attracted to the pressing tool, the pressing tool is disposed on a thin-film sheet such that the main surface thereof faces the back surface (the surface opposite to the main surface thereof formed with the probe) of the thin-film sheet. Then, the thin-film sheet with the pressing tool bonded thereto is attached to a probe card.