logo

For the Inventor, By the Inventor

Taoyuan, Taiwan

Shih-Kang Fu

This inventor holds 19 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Manufacturing. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shih-Kang Fu. Retrieved from https://idiyas.com/inventor/shih-kang-fu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19 

% Patents Active = 84.2

Average Co-Inventor Count = 3.2

ph-index = 2

Forward Citations = 17(Granted Patents)


Location History:

  • Taoyuan, TW (2018)
  • Zhongli, TW (2016 - 2021)
  • Taoyuan County, TW (2020 - 2023)
  • Hsinchu, TW (2022 - 2023)

Company Filing History:

goldMedal18 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 481 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2016-2026

Loading Chart...
Areas of Expertise:
Semiconductor Interconnect
Chemical-Mechanical Polishing
Barrier Metal Layer
Diffusion Barrier
CMP Process
Topography Control
Conductive Structure
Metal Layer Planarization
19 patents (USPTO):Explore Patents
1. 12721143 - Hybrid method for forming semiconductor interconnect structure (2026-08-25),
2. 12713896 - INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME (2026-08-18),
3. 12672527 - Semiconductor device including a self-formed barrier metal layer (2026-06-30),
4. 12362233 - Methods of performing chemical-mechanical polishing process in semiconductor devices (2025-07-15),
5. 12342600 - Titanium-containing diffusion barrier for CMP removal rate enhancement and contamination reduction (2025-06-24),
6. 12205886 - Hybrid method for forming semiconductor interconnect structure (2025-01-21),
7. 11810816 - Chemical mechanical polishing topography reset and control on interconnect metal lines (2023-11-07),
8. 11742239 - Methods of performing chemical-mechanical polishing process in semiconductor devices (2023-08-29),
9. 11545389 - Titanium-containing diffusion barrier for CMP removal rate enhancement and contamination reduction (2023-01-03),
10. 11450602 - Hybrid method for forming semiconductor interconnect structure (2022-09-20),
11. 11342219 - Chemical mechanical polishing topography reset and control on interconnect metal lines (2022-05-24),
12. 11211256 - Method with CMP for metal ion prevention (2021-12-28),
13. 11152255 - Methods of performing chemical-mechanical polishing process in semiconductor devices (2021-10-19),
14. 11127680 - Semiconductor device and manufacturing method thereof (2021-09-21),
15. 10879115 - Semiconductor device and forming method thereof (2020-12-29),

Title: Shih-Kang Fu: Innovator in Semiconductor Technology

Introduction

Shih-Kang Fu is a prolific inventor based in Taoyuan County, Taiwan. He holds an impressive portfolio of 16 patents, showcasing his expertise and contributions to the semiconductor industry. Fu's work is renowned for enhancing manufacturing processes and improving the performance of semiconductor devices.

Latest Patents

Among his latest patents, Shih-Kang Fu has developed innovative methods for performing chemical-mechanical polishing processes in semiconductor devices. This patent describes a semiconductor structure that includes a contact over a substrate, an interlayer dielectric layer with distinct regions and features designed to optimize performance. Another significant invention is a titanium-containing diffusion barrier that enhances the contact structure within semiconductor devices. This technology focuses on improving the removal rate during the chemical-mechanical polishing process while reducing contamination.

Career Highlights

Fu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm dedicated to advancing semiconductor technology. His role involves developing innovative solutions and processes to improve manufacturing efficiency and product quality.

Collaborations

Throughout his career, Shih-Kang Fu has collaborated with esteemed colleagues, including Ming-Han Lee and Shau-Lin Shue. Their combined efforts have resulted in impactful advancements in semiconductor technologies, contributing to the company's reputation for innovation and excellence.

Conclusion

Shih-Kang Fu's contributions to the field of semiconductor technology are commendable, with 16 patents reflecting his commitment to innovation. His work at Taiwan Semiconductor Manufacturing Company Limited continues to influence the industry, paving the way for future advancements in semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…