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For the Inventor, By the Inventor

Campbell, CA, United States of America

Shiann-Ming Liou

This inventor holds 71 USPTO granted patents and 12 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Marvell International Limited, Marvellworld Trade Ltd., Innogrit Technologies Co., Ltd.. Active years: 1991-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shiann-Ming Liou. Retrieved from https://idiyas.com/inventor/shiann-ming-liou

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 71 

% Patents Active = 59.2

Average Co-Inventor Count = 2.1

ph-index = 9

Forward Citations = 416(Granted Patents)

Forward Citations (Not Self Cited) = 402(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Campbell, CA (US) (1991 - 2022)
  • Shanghai, CN (2023)

Company Filing History:

goldMedal34 out of 5,162 
 
Marvell International Limited
 patents
silverMedal27 out of 1,901 
 
Marvellworld Trade Ltd.
 patents
bronzeMedal5 out of 91 
 
Innogrit Technologies Co., Ltd.
 patents
4. 4 out of 4,791 
 
National Semiconductor Corporation
 patents
5. 1 out of 122 
 
Marvell International Technology Ltd
 patents

Years Active: 1991-2023

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Areas of Expertise:
Chip Module
Multilayer Circuit Board
Interconnect Layouts
Ball Grid Array
Recessed Substrates
Package-on-Package
Thermal Management
Hybrid Die Package
Leadframe Design
Non-Volatile Storage
Semiconductor Die
Passive Components
71 patents (USPTO):Explore Patents
1. 11769708 - Packaging-level chip and chip module packaged with magnetic cover, and electronic product (2023-09-26),
2. 11706878 - Multilayer circuit board (2023-07-18),
3. 11308380 - Removable non-volatile storage card (2022-04-19),
4. 11276655 - Ground reference shape for high speed interconnect (2022-03-15),
5. 11043435 - Semiconductor die with hybrid wire bond pads (2021-06-22),
6. 10128171 - Leadframe with improved half-etch layout to reduce defects caused during singulation (2018-11-13),
7. 9768144 - Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate (2017-09-19),
8. 9666571 - Package-on-package structures (2017-05-30),
9. 9666510 - Dual row quad flat no-lead semiconductor package (2017-05-30),
10. 9543236 - Pad configurations for an electronic package assembly (2017-01-10),
11. 9425139 - Dual row quad flat no-lead semiconductor package (2016-08-23),
12. 9391045 - Recessed semiconductor substrates and associated techniques (2016-07-12),
13. 9355951 - Interconnect layouts for electronic assemblies (2016-05-31),
14. 9331052 - Pad configurations for an electronic package assembly (2016-05-03),
15. 9288909 - Ball grid array package substrate with through holes and method of forming same (2016-03-15),

Title: Innovations and Contributions of Shiann-Ming Liou

Introduction: Shiann-Ming Liou is an accomplished inventor based in Campbell, CA, who holds an impressive portfolio of 71 patents. His inventions primarily focus on advanced packaging techniques for semiconductor technologies and multilayer circuit board designs that enhance electrical performance.

Latest Patents: Among his latest innovations are two noteworthy patents: the packaging-level chip and chip module packaged with a magnetic cover, and the multilayer circuit board. The packaging-level chip features a unique structure that includes a die, packaging material, a substrate, and a magnetic cover, enabling improved functionality in electronic products. Additionally, the multilayer circuit board patent introduces a design incorporating multiple metal layers and specialized vias, allowing for efficient signal transmission between various layers.

Career Highlights: Shiann-Ming Liou has contributed significantly to the semiconductor industry during his tenure at renowned companies such as Marvell International Limited and Marvell World Trade Ltd. His work has focused on enhancing electronic product designs through innovative packaging solutions.

Collaborations: Throughout his career, Shiann-Ming Liou has collaborated with notable colleagues, including Chenglin Liu and Albert M. Wu. These partnerships have fostered an environment of creativity and technical excellence, leading to the successful development and commercialization of advanced technologies.

Conclusion: Shiann-Ming Liou stands out as a prominent inventor whose contributions to semiconductor packaging and circuit design continue to influence the technological landscape. His array of patents reflects a commitment to innovation and a keen understanding of the demands within the electronics industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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