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Shiann-Ming Liou

USPTO Granted Patents = 71 (Patent Applications = 12)

Average Co-Inventor Count = 2.1

ph-index = 9

Forward Citations = 410(Granted Patents)

Forward Citations (Not Self Cited) = 402(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Campbell, CA (US) (1991 - 2022)
Shanghai, CN (2023)

Company Filing History:

34 out of 5,162

Marvell International Limited

patents

27 out of 1,901

Marvellworld Trade Ltd.

patents

5 out of 91

Innogrit Technologies Co., Ltd.

patents

4. 4 out of 4,791

National Semiconductor Corporation

patents

5. 1 out of 122

Marvell International Technology Ltd

patents

Years Active: 1991-2023

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Areas of Expertise:

Semiconductor Packaging

Integrated Circuit Packaging

Multilayer Circuit Board

Package-on-Package Structures

Ball Grid Array Package

Recessed Semiconductor Substrates

Leadless Multi-Chip Module

Thermal Enhanced Package

Interconnect Layouts

Chip on Leads

Non-Volatile Storage Card

Hybrid Wire Bond Pads

71 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11769708 - Packaging-level chip and chip module packaged with magnetic cover, and electronic product (2023-09-26),

2. 11706878 - Multilayer circuit board (2023-07-18),

3. 11308380 - Removable non-volatile storage card (2022-04-19),

4. 11276655 - Ground reference shape for high speed interconnect (2022-03-15),

5. 11043435 - Semiconductor die with hybrid wire bond pads (2021-06-22),

6. 10128171 - Leadframe with improved half-etch layout to reduce defects caused during singulation (2018-11-13),

7. 9768144 - Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate (2017-09-19),

8. 9666571 - Package-on-package structures (2017-05-30),

9. 9666510 - Dual row quad flat no-lead semiconductor package (2017-05-30),

10. 9543236 - Pad configurations for an electronic package assembly (2017-01-10),

11. 9425139 - Dual row quad flat no-lead semiconductor package (2016-08-23),

12. 9391045 - Recessed semiconductor substrates and associated techniques (2016-07-12),

13. 9355951 - Interconnect layouts for electronic assemblies (2016-05-31),

14. 9331052 - Pad configurations for an electronic package assembly (2016-05-03),

15. 9288909 - Ball grid array package substrate with through holes and method of forming same (2016-03-15),

Title: Innovations and Contributions of Shiann-Ming Liou

Introduction: Shiann-Ming Liou is an accomplished inventor based in Campbell, CA, who holds an impressive portfolio of 71 patents. His inventions primarily focus on advanced packaging techniques for semiconductor technologies and multilayer circuit board designs that enhance electrical performance.

Latest Patents: Among his latest innovations are two noteworthy patents: the packaging-level chip and chip module packaged with a magnetic cover, and the multilayer circuit board. The packaging-level chip features a unique structure that includes a die, packaging material, a substrate, and a magnetic cover, enabling improved functionality in electronic products. Additionally, the multilayer circuit board patent introduces a design incorporating multiple metal layers and specialized vias, allowing for efficient signal transmission between various layers.

Career Highlights: Shiann-Ming Liou has contributed significantly to the semiconductor industry during his tenure at renowned companies such as Marvell International Limited and Marvell World Trade Ltd. His work has focused on enhancing electronic product designs through innovative packaging solutions.

Collaborations: Throughout his career, Shiann-Ming Liou has collaborated with notable colleagues, including Chenglin Liu and Albert M. Wu. These partnerships have fostered an environment of creativity and technical excellence, leading to the successful development and commercialization of advanced technologies.

Conclusion: Shiann-Ming Liou stands out as a prominent inventor whose contributions to semiconductor packaging and circuit design continue to influence the technological landscape. His array of patents reflects a commitment to innovation and a keen understanding of the demands within the electronics industry.

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