The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2018
Filed:
Mar. 24, 2017
Applicant:
Marvell International Ltd., Hamilton, BM;
Inventors:
Huahung Kao, San Jose, CA (US);
Shiann-Ming Liou, Campbell, CA (US);
Assignee:
Marvell International Ltd., Hamilton, BM;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/495 (2006.01); H01L 21/78 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); H01L 21/4828 (2013.01); H01L 21/4842 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/49537 (2013.01);
Abstract
A leadframe matrix for mounting and packaging semiconductor dice includes a plurality of leadframes each including leads arranged along peripheral sides thereof. An interconnecting leadframe portion connects a first peripheral side of a first one of the plurality of leadframes to a second peripheral side of a second one of the plurality of leadframes. The leads along the first peripheral side include partially etched portions. The partially etched portions of the leads are at least partially contiguous with and connected to the interconnecting leadframe portions.