The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2023
Filed:
May. 26, 2021
Applicant:
Innogrit Technologies Co., Ltd., Shanghai, CN;
Inventors:
Yanwen Bai, Shanghai, CN;
Shiann-Ming Liou, Shanghai, CN;
Assignee:
INNOGRIT TECHNOLOGIES CO., LTD., Shanghai, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/40 (2013.01); H01L 23/3128 (2013.01);
Abstract
The present disclosure provides a packaging-level chip and a chip module packaged with a magnetic cover, and an electronic product. The packaging-level chip packaged with a magnetic cover comprises a die, a packaging material, a substrate and a magnetic cover. The packaging material is packaged on the outside of the die which is arranged on the substrate, and the magnetic cover is packaged on the top of the packaging material and is magnetic.
Bai, Yanwen. (2023). Packaging-level chip and chip module packaged with magnetic cover, and electronic product (U.S. Patent No. 11769708). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11769708
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile