Shi-Min Wu

Title: Shi-Min Wu: Innovator in Integrated Chip Technology

Introduction

Shi-Min Wu is a prominent inventor based in Changhua County, Taiwan. He has made significant contributions to the field of integrated chip technology, holding a total of seven patents. His work focuses on innovative solutions to enhance the performance and reliability of integrated circuits.

Latest Patents

Among his latest patents is a trench capacitor film scheme designed to reduce substrate warpage. This invention involves an integrated chip that features a trench capacitor overlying a substrate. The trench capacitor consists of multiple capacitor electrode structures, warping reduction structures, and capacitor dielectric structures that are alternately stacked. These components define a trench segment that extends vertically into the substrate, incorporating both metal and nitrogen components. Another notable patent is the trench capacitor profile aimed at decreasing substrate warpage. This patent describes an integrated chip that includes a capacitor with a base structure and a protrusion structure extending downward towards the substrate. The design includes conductive and dielectric layers that define a cavity, enhancing the overall functionality of the integrated chip.

Career Highlights

Shi-Min Wu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing the technology used in integrated circuits, making him a valuable asset to his company.

Collaborations

Shi-Min Wu has collaborated with notable colleagues, including Hsin-Li Cheng and Jyun-Ying Lin, who contribute to the innovative environment at their workplace.

Conclusion

Shi-Min Wu's contributions to integrated chip technology through his patents demonstrate his commitment to innovation and excellence in the field. His work continues to influence the development of advanced semiconductor solutions.