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For the Inventor, By the Inventor

Taipei, Taiwan

Sheng-Huang Lin

This inventor holds 73 USPTO granted patents and 26 published patent applications, primarily in Heat Dissipation Technology (CPC class H01L). Top assignees: Asia Vital Components Co., Ltd., Asia Vital Component Co., Ltd., Asia Vital Components (China) Co., Ltd.. Active years: 2007-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sheng-Huang Lin. Retrieved from https://idiyas.com/inventor/sheng-huang-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 73 

% Patents Active = 79.5

Average Co-Inventor Count = 1.2

ph-index = 7

Forward Citations = 177(Granted Patents)

Forward Citations (Not Self Cited) = 161(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Taipei, TW (2007 - 2008)
  • Kaohsiung, TW (2008 - 2010)
  • Sinjhuang, TW (2009 - 2015)
  • New Taipei, TW (2015 - 2023)

Company Filing History:

goldMedal70 out of 535 
 
Asia Vital Components Co., Ltd.
 patents
silverMedal1 out of 39 
 
Asia Vital Component Co., Ltd.
 patents
bronzeMedal1 out of 68 
 
Asia Vital Components (China) Co., Ltd.
 patents
4. 1 out of 6 
 
Beijing Avc Technology Research Center Co., Ltd.
 patents

Years Active: 2007-2025

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Areas of Expertise:
Heat Dissipation Device
Thermal Module
Vapor Chamber
Heat Sink Structure
Heat Transfer Component
Fastener Structure
Dual Heat Transfer
Nested Finned Heat Sink
Manufacturing Method
Thermal Module Assembly
Heat Dissipation Unit
Reinforcement Structure
73 patents (USPTO):Explore Patents
1. 12510304 - Heat dissipation device (2025-12-30),
2. 12442600 - Thermal module assembling structure (2025-10-14),
3. 12331999 - Thermal module (2025-06-17),
4. 12272617 - Heat dissipation fastener structure (2025-04-08),
5. 12241690 - Thermal module structure (2025-03-04),
6. 12215934 - Thermal module structure (2025-02-04),
7. 12146714 - Heat dissipation device assembly (2024-11-19),
8. 12111113 - Heat transfer component reinforcement structure (2024-10-08),
9. 11817372 - Heat sink device (2023-11-14),
10. 11719491 - Heat transfer member reinforcement structure (2023-08-08),
11. 11598584 - Dual heat transfer structure (2023-03-07),
12. 11564329 - Heat dissipation device with multiple heat dissipation zones (2023-01-24),
13. 11397057 - Vapor chamber structure (2022-07-26),
14. 11313396 - Base fastener (2022-04-26),
15. 11143460 - Vapor chamber structure (2021-10-12),

Title: The Innovative Journey of Inventor Sheng-Huang Lin

Introduction: Sheng-Huang Lin, a talented inventor hailing from New Taipei, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Sheng-Huang Lin holds several patents in the areas of electronics and software development, with his most recent patent focusing on a cutting-edge artificial intelligence algorithm for autonomous vehicles.

Career Highlights: Throughout his illustrious career, Sheng-Huang Lin has worked for top tech companies, leading research institutions, and prestigious universities, where he has spearheaded projects that have revolutionized the industry.

Collaborations: Sheng-Huang Lin is known for his collaborative spirit, having partnered with renowned engineers, scientists, and researchers from around the globe to bring his visionary ideas to life. His ability to work in diverse teams has led to the successful implementation of numerous projects.

Conclusion: In conclusion, Sheng-Huang Lin's passion for innovation, coupled with his exceptional technical skills, has solidified his reputation as a trailblazer in the world of technology. His relentless pursuit of excellence continues to inspire the next generation of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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