The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2024

Filed:

Dec. 12, 2022
Applicant:

Asia Vital Components Co., Ltd., New Taipei, TW;

Inventors:

Sheng-Huang Lin, New Taipei, TW;

Yuan-Yi Li, New Taipel, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F28F 21/08 (2006.01); F28D 15/02 (2006.01); F28F 1/32 (2006.01); F28F 9/26 (2006.01); H01L 21/48 (2006.01); H01L 23/427 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
F28F 21/084 (2013.01); F28D 15/0275 (2013.01); F28F 21/085 (2013.01); H01L 21/4882 (2013.01); H01L 23/427 (2013.01); H05K 7/20336 (2013.01); H05K 7/20418 (2013.01); F28F 1/32 (2013.01); F28F 9/268 (2013.01); F28F 2275/06 (2013.01);
Abstract

A heat dissipation device assembly includes an aluminum base seat, an aluminum radiating fin assembly and at least one U-shaped copper heat pipe, which is upright arranged or horizontally arranged. The aluminum base seat has at least one connection section. A copper embedding layer is disposed on the connection section. The aluminum radiating fin assembly is assembled and disposed on the aluminum base seat. The copper heat pipe has a heat dissipation section and a heat absorption section respectively connected on the aluminum radiating fin assembly and the connection section of the aluminum base seat. By means of the copper embedding layer, the aluminum base seat and the copper heat pipe can be directly welded and connected with each other without chemical nickel treatment.


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