The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2025

Filed:

Dec. 12, 2022
Applicant:

Asia Vital Components Co., Ltd., New Taipei, TW;

Inventors:

Sheng-Huang Lin, New Taipei, TW;

Yuan-Yi Lin, New Taipel, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/02 (2006.01); F28F 3/04 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
F28D 15/0275 (2013.01); F28F 3/048 (2013.01); H05K 7/20336 (2013.01);
Abstract

A heat dissipation device includes an aluminum base seat and any or both of at least one copper two-phase fluid component and a copper heat conduction component. The aluminum base seat has an upper face and a lower face. A connection section is formed on the lower face and a copper embedding layer is disposed on the connection section. Any or both of the copper two-phase fluid component and the copper heat conduction component are disposed on the connection section and connected with the copper embedding layer. By means of the copper embedding layer disposed on the connection section, the aluminum base seat can be directly welded and connected with the copper two-phase fluid component and/or the copper heat conduction component made of heterogeneous metal materials without chemical nickel treatment procedure.


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