IDiyas

For the Inventor, By the Inventor

Albany, NY, United States of America

Shariq Siddiqui

USPTO Granted Patents = 24 

Average Co-Inventor Count = 4.1

ph-index = 4

Forward Citations = 59(Granted Patents)


Location History:

  • Albany, NY (US) (2016 - 2021)
  • Delmar, NY (US) (2019 - 2021)

Company Filing History:

goldMedal21 out of 5,671 
 
Globalfoundries Inc.
 patents
silverMedal16 out of 164,108 
 
International Business Machines Corporation
 patents
bronzeMedal1 out of 15,458 
 
University of California
 patents
where one patent can have more than one assignee

Years Active: 2016-2021

Loading Chart...
24 patents (USPTO):
1. 10957588 - Chamferless via structures (2021-03-23),
2. 10937694 - Chamferless via structures (2021-03-02),
3. 10903118 - Chamferless via structures (2021-01-26),
4. 10818599 - Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contacts (2020-10-27),
5. 10658176 - Methods of mitigating cobalt diffusion in contact structures and the resulting devices (2020-05-19),
6. 10629428 - Metal insulator metal capacitor devices (2020-04-21),
7. 10388565 - Chamferless via structures (2019-08-20),
8. 10347541 - Active gate contacts and method of fabrication thereof (2019-07-09),
9. 10340146 - Reliability caps for high-k dielectric anneals (2019-07-02),
10. 10211094 - Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contacts (2019-02-19),
11. 10170574 - Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contacts (2019-01-01),
12. 10139358 - Method for characterization of a layered structure (2018-11-27),
13. 10134585 - Low temperature atomic layer deposition of oxides on compound semiconductors (2018-11-20),
14. 10062560 - Method of cleaning semiconductor device (2018-08-28),
15. 10032668 - Chamferless via structures (2018-07-24),

Title: Shariq Siddiqui: A Pioneer in Chamferless Via Structures

Introduction

Shariq Siddiqui is a prominent inventor based in Albany, NY, USA, holding an impressive portfolio of 24 patents. His innovative contributions to the field have demonstrated a significant impact on modern manufacturing processes, particularly in the electronics sector.

Latest Patents

Among his latest achievements are two notable patents related to chamferless via structures. The first patent describes a method for forming self-aligned vias within dielectric materials. This innovative process involves plugging the vias with material, applying a protective sacrificial mask, creating trenches, and ultimately achieving conductive wiring vias. The second patent parallels the first but focuses on non-self-aligned vias, employing a similar method to ensure efficient manufacturing and quality in the production of electronic components.

Career Highlights

Shariq Siddiqui has worked with renowned companies, including GlobalFoundries Inc. and the International Business Machines Corporation (IBM). His extensive experience in these organizations has equipped him with the knowledge and expertise necessary to push the boundaries of technology and innovation in his field.

Collaborations

Throughout his career, Shariq has collaborated with esteemed colleagues, including Frank Wilhelm Mont and Brown Cornelius Peethala. These partnerships have fostered a collaborative environment that encourages creativity and the innovative development of patentable technologies.

Conclusion

Shariq Siddiqui's contributions to the realm of chamferless via structures are just a glimpse into the breadth of his work as an inventor. His patents showcase a commitment to advancing manufacturing techniques, which serves to benefit the electronics industry and beyond. His career exemplifies the spirit of innovation and collaboration that drives progress in technology today.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…