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For the Inventor, By the Inventor

Penang, Malaysia

Shanggar Periaman

USPTO Granted Patents = 19 

Average Co-Inventor Count = 3.8

ph-index = 8

Forward Citations = 514(Granted Patents)


Location History:

  • Butterworth, MY (2010)
  • Georgetown, MY (2015)
  • Penang, MY (2007 - 2017)
  • Gelugor, MY (2017 - 2019)

Company Filing History:

goldMedal19 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2007-2019

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19 patents (USPTO):Explore Patents
1. 10403604 - Stacked package assembly with voltage reference plane (2019-09-03),
2. 10396038 - Flexible packaging architecture (2019-08-27),
3. 9812425 - Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same (2017-11-07),
4. 9778688 - Flexible system-in-package solutions for wearable devices (2017-10-03),
5. 9721878 - High density second level interconnection for bumpless build up layer (BBUL) packaging technology (2017-08-01),
6. 9646953 - Integrated circuit packaging techniques and configurations for small form-factor or wearable devices (2017-05-09),
7. 9478524 - Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same (2016-10-25),
8. 9136251 - Method to enable controlled side chip interconnection for 3D integrated packaging system (2015-09-15),
9. 8987896 - High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming same (2015-03-24),
10. 8697495 - Stacked die package (2014-04-15),
11. 8281229 - Firmware verification using system memory error check logic (2012-10-02),
12. 8198716 - Die backside wire bond technology for single or stacked die package (2012-06-12),
13. 8110930 - Die backside metallization and surface activated bonding for stacked die packages (2012-02-07),
14. 8044497 - Stacked die package (2011-10-25),
15. 7773504 - Bandwidth allocation for network packet traffic (2010-08-10),

Title: **Shanggar Periaman: Innovator in Semiconductor Packaging**

Introduction

Shanggar Periaman, based in Penang, Malaysia, is a notable inventor in the semiconductor industry. With a remarkable portfolio comprising 19 patents, Shanggar focuses on advanced packaging solutions that enhance the performance and efficiency of electronic devices.

Latest Patents

Among his most recent patents are innovative designs that address critical challenges in stacked package assemblies. One of his notable inventions is the "Stacked Package Assembly with Voltage Reference Plane." This invention details a structure comprising multiple die packages that are stacked with interconnections, featuring a voltage reference plane integrated within the package for improved operation. Another significant contribution is the "Flexible Packaging Architecture," which introduces a design suited for curved package shapes, marking a leap forward in flexibility and application.

Career Highlights

Shanggar Periaman currently works at Intel Corporation, where he applies his expertise in semiconductor technologies to drive innovations. His work is instrumental in developing cutting-edge packaging solutions that cater to the evolving needs of the electronics market.

Collaborations

At Intel Corporation, Shanggar collaborates with talented individuals such as Kooi Chi Ooi and Bok Eng Cheah, highlighting the importance of teamwork in advancing technological innovations and addressing complex engineering challenges.

Conclusion

Shanggar Periaman’s contributions to the field of semiconductor packaging are significant and impactful. His patents not only showcase his creativity and problem-solving skills but also reflect the industry's shift towards more complex and efficient packaging technologies. Through his work at Intel and in collaboration with his colleagues, Shanggar continues to influence the future of electronic packaging solutions.

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