The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2017
Filed:
Nov. 12, 2014
Intel Corporation, Santa Clara, CA (US);
Jiamiao Tang, Shanghai, CN;
Junfeng Zhao, Shanghai, CN;
Michael P. Skinner, San Jose, CA (US);
Yong She, Minghang, CN;
Jiun Hann Sir, Gelugor, MY;
Bok Eng Cheah, Bayan Lepas, MY;
Shanggar Periaman, Gelugor, MY;
Kooi Chi Ooi, Glugor, MY;
Yen Hsiang Chew, Georgetown, MY;
INTEL CORPORATION, Santa Clara, CA (US);
Abstract
Embodiments of the present disclosure are directed towards an integrated circuit (IC) package. In embodiments, an integrated circuit (IC) package may include a flexible substrate. The flexible substrate may have a plurality of dies coupled therewith. The IC package may include a first encapsulation material, having a first rigidity, disposed on the flexible substrate to at least partially encapsulate each die of the plurality dies. The IC package may further include a second encapsulation material, having a second rigidity, disposed on the flexible substrate. In embodiments, the second rigidity and the first rigidity are different from one another. Other embodiments may be described and/or claimed.