The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
Sep. 26, 2014
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Bok Eng Cheah, Bayan Lepas, MY;
Jackson Chung Peng Kong, Tanjung Tokong, MY;
Shanggar Periaman, Gelugor, MY;
Michael Skinner, San Jose, CA (US);
Yen Hsiang Chew, Georgetown, MY;
Kheng Tat Mar, Air Itam, MY;
Ridza Effendi Abd Razak, Lunas, MY;
Kooi Chi Ooi, Glugor, MY;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/10 (2006.01); H01L 23/538 (2006.01); H01L 23/495 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5387 (2013.01); H01L 23/3736 (2013.01); H01L 23/4985 (2013.01); H01L 23/49572 (2013.01); H01L 24/16 (2013.01); H01L 24/18 (2013.01); H01L 24/19 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 21/4846 (2013.01); H01L 23/5389 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/18 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/73259 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die.