The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
Nov. 05, 2015
Intel Corporation, Santa Clara, CA (US);
Bok Eng Cheah, Bayan Lepas, MY;
Jackson Chung Peng Kong, Tanjung Tokong, MY;
Ping Ping Ooi, Butterworth, MY;
Kooi Chi Ooi, Gelugor, MY;
Shanggar Periaman, Gelugor, MY;
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments of the present disclosure are directed toward a stacked package assembly for embedded dies and associated techniques and configurations. In one embodiment, stacked package assembly may comprise a first die package and a second die package stacked one upon the other with plural interconnections between them; and a voltage reference plane embedded in at least one of the first and second die packages in proximity and generally parallel to the other of the first and second die packages.