The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2011
Filed:
Sep. 10, 2007
Bok Eng Cheah, Penang, MY;
Shanggar Periaman, Penang, MY;
Kooi Chi Ooi, Penang, MY;
Yen Hsiang Chew, Penang, MY;
Bok Eng Cheah, Penang, MY;
Shanggar Periaman, Penang, MY;
Kooi Chi Ooi, Penang, MY;
Yen Hsiang Chew, Penang, MY;
Intel Corporation, Santa Clara, CA (US);
Abstract
The formation of electronic assemblies is described. One embodiment includes first and second semiconductor die structures each including a front side and a backside, the front side including an active region and the backside including metal regions and non-metal regions thereon. The first and second semiconductor die structures include a plurality of vias, the vias forming electrical connections between the active region and the backside metal regions. The first and second semiconductor die structures are stacked together with at least one of the metal regions on the backside of the first semiconductor die structure in direct contact with at least one of the metal regions on the back side of the second semiconductor die structure. Other embodiments are described and claimed.