The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2012
Filed:
Mar. 26, 2007
Applicants:
Shanggar Periaman, Penang, MY;
Kooi Chi Ooi, Penang, MY;
Bok Eng Cheah, Penang, MY;
Yen Hsiang Chew, Penang, MY;
Inventors:
Shanggar Periaman, Penang, MY;
Kooi Chi Ooi, Penang, MY;
Bok Eng Cheah, Penang, MY;
Yen Hsiang Chew, Penang, MY;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
Methods and apparatus to provide die backside connections are described. In one embodiment, the backside of a die is metallized and coupled to another die or a substrate. Other embodiments are also described.