IDiyas

For the Inventor, By the Inventor

Singapore, Singapore

Seung Uk Yoon

USPTO Granted Patents = 17 

Average Co-Inventor Count = 3.6

ph-index = 9

Forward Citations = 403(Granted Patents)


Company Filing History:

goldMedal12 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents
silverMedal3 out of 15 
 
Jcet Semiconductor (shaoxing) Co., Ltd.
 patents
bronzeMedal2 out of 1,473 
 
Agency for Science, Technology and Research
 patents

Years Active: 2007-2021

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17 patents (USPTO):Explore Patents
1. RE48408 - Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect (2021-01-25),
2. RE48111 - Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect (2020-07-20),
3. 10643952 - Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die (2020-05-05),
4. 9893045 - Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect (2018-02-13),
5. 9754858 - Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die (2017-09-05),
6. 9484279 - Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die (2016-11-01),
7. 9240380 - Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect (2016-01-19),
8. 8957530 - Integrated circuit packaging system with embedded circuitry and post (2015-02-17),
9. 8896109 - Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die (2014-11-25),
10. 8822281 - Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier (2014-09-02),
11. 8518746 - Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die (2013-08-27),
12. 8383457 - Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect (2013-02-26),
13. 8354297 - Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die (2013-01-15),
14. 7888184 - Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof (2011-02-15),
15. 7786008 - Integrated circuit packaging system having through silicon vias with partial depth metal fill regions and method of manufacture thereof (2010-08-31),

Title: Innovations by Seung Uk Yoon: Pioneering Semiconductor Technology in Singapore

Introduction

Seung Uk Yoon is a distinguished inventor based in Singapore with a remarkable portfolio of 17 patents. His innovative contributions primarily lie in the semiconductor field, where he has developed cutting-edge technologies that enhance device performance and functionality.

Latest Patents

One of Seung Uk Yoon's latest patents focuses on a semiconductor device and method of forming an interposer frame over a semiconductor die to provide vertical interconnect. This invention features a first semiconductor die mounted over a carrier, with an interposer frame that includes an opening and multiple conductive pillars. This design allows for effective integration of the die and carrier, optimizing the encapsulation process and interconnect structure. The innovative encapsulation method ensures that excess material is efficiently managed, thereby improving device reliability.

Career Highlights

Throughout his career, Seung Uk Yoon has held pivotal roles in prominent companies such as Stats Chippac Pte. Ltd. and JCET Semiconductor (Shaoxing) Co., Ltd. His work in these organizations reflects his commitment to advancing semiconductor technology and enhancing manufacturing processes.

Collaborations

In his professional journey, Seung Uk Yoon has collaborated with esteemed colleagues including Reza A. Pagaila and Seng Guan Chow. These partnerships have been instrumental in fostering innovation and driving forward the development of semiconductor solutions in the industry.

Conclusion

Seung Uk Yoon's contributions to the semiconductor field illustrate the profound impact of innovation on technology. His numerous patents and collaborations mark him as a significant figure in his industry, shaping the future of semiconductor devices and methodologies. As he continues to drive advancements, his work stands as a testament to the importance of innovation in creating efficient and reliable technology solutions.

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