The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2011
Filed:
May. 27, 2009
IL Kwon Shim, Singapore, SG;
Seng Guan Chow, Singapore, SG;
Heap Hoe Kuan, Singapore, SG;
Seung Uk Yoon, Singapore, SG;
Jong-woo Ha, Seoul, KR;
Il Kwon Shim, Singapore, SG;
Seng Guan Chow, Singapore, SG;
Heap Hoe Kuan, Singapore, SG;
Seung Uk Yoon, Singapore, SG;
Jong-Woo Ha, Seoul, KR;
Stats Chippac Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a shaped platform with a conductive post; mounting the shaped platform with the conductive post over a temporary carrier; mounting an integrated circuit device over the temporary carrier; encapsulating the conductive post and the integrated circuit device; removing a portion of the shaped platform isolating the conductive post; and removing the temporary carrier.