Company Filing History:

17 out of 59

Tru-si Technologies, Inc.

patents

10 out of 1,853

Adeia Semiconductor Bonding Technologies Inc.

Years Active: 2001-2017

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28 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9589879 - Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates (2017-03-07),

2. 9515024 - Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor (2016-12-06),

3. 9323010 - Structures formed using monocrystalline silicon and/or other materials for optical and other applications (2016-04-26),

4. 9142511 - Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor layers (2015-09-22),

5. 9111902 - Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques (2015-08-18),

6. 9018094 - Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates (2015-04-28),

7. 8829683 - Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor layers (2014-09-09),

8. 8757897 - Optical interposer (2014-06-24),

9. 8633589 - Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques (2014-01-21),

10. 8431431 - Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor layers (2013-04-30),

11. 7964508 - Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques (2011-06-21),

12. 7521360 - Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby (2009-04-21),

13. 7510928 - Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques (2009-03-31),

14. 7241675 - Attachment of integrated circuit structures and other substrates to substrates with vias (2007-07-10),

15. 7241641 - Attachment of integrated circuit structures and other substrates to substrates with vias (2007-07-10),

Title: **Innovative Contributions of Sergey Savastiouk in Semiconductor Technologies**

Introduction

Sergey Savastiouk, based in San Jose, CA, has established himself as a leading inventor in the semiconductor field with a remarkable portfolio of 28 patents. His pioneering work primarily focuses on innovative substrates and methods that enhance the connectivity and functionality of integrated circuit elements, contributing significantly to the advancement of semiconductor technology.

Latest Patents

Among his latest patents, Sergey has developed novel substrates with through vias featuring conductive elements designed for seamless connection to integrated circuit elements. One of his notable inventions involves a through via that contains a conductor traversing a substrate, comprising two segments formed from different sides of the substrate. This innovative structure facilitates via formation, as each segment is intentionally shorter than the entire via. His intricate method includes the deposition of an etch stop layer that allows for less rigid control of the first segment's depth, enabling more efficient deposition of conductive material from both sides of the substrate at shallower depths than the overall via depth.

Another recent patent highlights a structure with through vias that pass through a substrate containing a planar insulating layer. This configuration enhances control over the depths of constituent vias and promotes efficient deposition processes. These patents reflect Sergey’s commitment to pushing the boundaries of current semiconductor technologies and improving manufacturing processes.

Career Highlights

Throughout his career, Sergey has made substantial contributions while working with several companies, notably Tru-Si Technologies, Inc. and Adeia Semiconductor Bonding Technologies Inc. His experiences have shaped his unique approach to semiconductor design and fabrication, allowing him to translate complex technical challenges into practical solutions.

Collaborations

Sergey has worked alongside esteemed colleagues, including Valentin Kosenko and Oleg Siniaguine. Their collaborative efforts have fostered an innovative environment that cultivates groundbreaking advancements in semiconductor technologies. Together, they have contributed to the creation of sophisticated designs and methodologies that enhance semiconductor performance.

Conclusion

Sergey Savastiouk’s dedication to innovation in semiconductor technology, demonstrated through his 28 patents, is a testament to his expertise and forward-thinking approach. His recent patents not only reflect his ingenuity but also highlight his significant impact on the future of integrated circuit technology. As the industry continues to evolve, his work will undoubtedly remain influential, paving the way for new advancements in semiconductor design and manufacturing.

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4 patents (EPO):

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Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.