The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2014
Filed:
Jan. 31, 2012
Valentin Kosenko, Mountain View, CA (US);
Edward Lee Mcbain, Scottsdale, AZ (US);
Cyprian Emeka Uzoh, San Jose, CA (US);
Pezhman Monadgemi, Fremont, CA (US);
Sergey Savastiouk, Saratoga, CA (US);
Valentin Kosenko, Mountain View, CA (US);
Edward Lee McBain, Scottsdale, AZ (US);
Cyprian Emeka Uzoh, San Jose, CA (US);
Pezhman Monadgemi, Fremont, CA (US);
Sergey Savastiouk, Saratoga, CA (US);
Invensas Corporation, San Jose, CA (US);
Abstract
An optical interposer includes grooves () for optical fiber cables () coupled to a transducer (). The grooves are formed by etching a cavity () in a substrate (), filling the cavity with some layer (), then etching the layer to form the grooves. The cavity has outwardly sloped sidewalls on which mirrors () are later formed. The groove etch is selective not to damage the sidewalls. The groove depth is uniform due to high etch selectivity of the layer, and also because of good control over the cavity etch due to the low aspect ratio of the cavity. Electrical circuitry for connection to the transducer is fabricated after the cavity filling but before the groove etch. The cavity filling leaves the wafer planar, facilitating fabrication of the electrical circuitry. Grooves can be provided on top and bottom of the interposer. Other features are also provided.