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For the Inventor, By the Inventor

Daejeon, South Korea

Seok-Hwan Moon

USPTO Granted Patents = 13 

Average Co-Inventor Count = 5.8

ph-index = 2

Forward Citations = 20(Granted Patents)


Location History:

  • Taejon, KR (2003)
  • Daejeon, KR (2013 - 2022)

Company Filing History:

goldMedal13 out of 11,277 
 
Electronics and Telecommunications Research Institute
 patents

Years Active: 2003-2025

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13 patents (USPTO):Explore Patents
1. 12457833 - Electronic device and its repair method (2025-10-28),
2. 12349505 - Method of manufacturing electric device (2025-07-01),
3. 12206056 - Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materials (2025-01-21),
4. 11488841 - Method for manufacturing semiconductor package (2022-11-01),
5. 11107790 - Laser bonding method (2021-08-31),
6. 10020201 - Semiconductor device and method of fabricating the same (2018-07-10),
7. 9337121 - Semiconductor device and method of fabricating the same (2016-05-10),
8. 9296205 - Active cliche for large-area printing, manufacturing method of the same, and printing method using the same (2016-03-29),
9. 9159583 - Methods of manufacturing nitride semiconductor devices (2015-10-13),
10. 9085140 - Active cliche for large-area printing, manufacturing method of the same, and printing method using the same (2015-07-21),
11. 9024511 - Impact-type piezoelectric micro power generator (2015-05-05),
12. 8584743 - Solid type heat dissipation device (2013-11-19),
13. 6619384 - Heat pipe having woven-wire wick and straight-wire wick (2003-09-16),

Title: Innovator Spotlight: Seok-Hwan Moon - Pioneering Innovations in Semiconductor Packaging.

Introduction:

Seok-Hwan Moon is a renowned inventor based in Daejeon, South Korea, with an impressive portfolio of 10 patents in the field of semiconductor technology. His groundbreaking work has significantly contributed to advancements in the manufacturing processes of semiconductor packages, with a focus on laser bonding techniques.

Latest Patents:

1. Method for Manufacturing Semiconductor Package: Seok-Hwan Moon's innovative method involves bonding a semiconductor chip onto a substrate using a specialized bonding member that includes a thermosetting resin, a curing agent, and a laser-absorbing agent. The process utilizes laser irradiation on the substrate for precise bonding.

2. Laser Bonding Method: This patent details a laser bonding method that incorporates an adhesive layer with conductive particles on a substrate. By heating the bonding target with a laser, the conductive particles electrically connect the substrate and the bonding target, facilitating a secure bond.

Career Highlights:

Seok-Hwan Moon is a key figure at the Electronics and Telecommunications Research Institute, where he continues to push the boundaries of semiconductor packaging technology. His expertise and inventions have garnered recognition in the industry, solidifying his reputation as a trailblazer in the field.

Collaborations:

Working alongside talented individuals such as Chi Hoon Jun and Sang Choon Ko, Seok-Hwan Moon has leveraged collaborative efforts to drive innovation and bring his pioneering ideas to fruition. These collaborations have enriched his research and contributed to the success of his patented inventions.

Conclusion:

Seok-Hwan Moon's commitment to excellence and his innovative approach to semiconductor packaging have established him as a leading inventor in the industry. His patents not only showcase his technical expertise but also reflect his dedication to advancing technology and solving complex challenges in semiconductor manufacturing. Seok-Hwan Moon's contributions are shaping the future of semiconductor packaging, and his work continues to inspire generations of inventors in the field.

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