The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Jun. 17, 2022
Electronics and Telecommunications Research Institute, Daejeon, KR;
Ki Seok Jang, Daejeon, KR;
Yong Sung Eom, Daejeon, KR;
Gwang-Mun Choi, Daejeon, KR;
Kwang-Seong Choi, Daejeon, KR;
Jiho Joo, Daejeon, KR;
Seok-Hwan Moon, Daejeon, KR;
Chanmi Lee, Daejeon, KR;
Electronics and Telecommunications Research Institute, Daejeon, KR;
Abstract
A laser bonding method and a laser control structure are provided. The method includes forming bonding portions on a substrate, providing a bonding object and a laser control structure, and irradiating laser light. The laser control structure includes a first substrate having first and second regions. A first thin film laminate, comprising alternating first and second thin film layers, is disposed on the first region. A second thin film laminate, comprising alternating third and fourth thin film layers, is disposed on the second region. Reflectance or absorptivity of the first thin film laminate differs from that of the second thin film laminate based on different thicknesses and numbers of the laminated layers. Accordingly, bonding temperatures are selectively controlled for different regions during a single laser irradiation.