The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
Feb. 19, 2020
Applicant:
Electronics and Telecommunications Research Institute, Daejeon, KR;
Inventors:
Yong Sung Eom, Daejeon, KR;
Kwang-Seong Choi, Daejeon, KR;
Ki Seok Jang, Sejong-si, KR;
Seok-Hwan Moon, Daejeon, KR;
Jiho Joo, Sejong-si, KR;
Assignee:
Electronics and Telecommunications Research Institute, Daejeon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 21/50 (2013.01); H01L 21/4853 (2013.01); H01L 24/81 (2013.01); H01L 2021/60112 (2013.01); H01L 2021/60225 (2013.01); H01L 2224/81224 (2013.01);
Abstract
Provided is a method for manufacturing a semiconductor package, the method including providing a semiconductor chip on a substrate, providing a bonding member between the substrate and the semiconductor chip, and bonding the semiconductor chip on the substrate by irradiating of a laser on the substrate. Here, the bonding member may include a thermosetting resin, a curing agent, and a laser absorbing agent.