The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2025

Filed:

Jul. 14, 2022
Applicant:

Electronics and Telecommunications Research Institute, Daejeon, KR;

Inventors:

Kwang-Seong Choi, Daejeon, KR;

Yong-Sung Eom, Daejeon, KR;

Jiho Joo, Daejeon, KR;

Gwang-Mun Choi, Daejeon, KR;

Seok-Hwan Moon, Daejeon, KR;

Ho-Gyeong Yun, Daejeon, KR;

Chanmi Lee, Daejeon, KR;

Ki-Seok Jang, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/857 (2025.01); H01L 25/075 (2006.01); H10H 20/01 (2025.01);
U.S. Cl.
CPC ...
H10H 20/857 (2025.01); H01L 25/0753 (2013.01); H10H 20/01 (2025.01); H10H 20/0364 (2025.01);
Abstract

Provided is an electronic device including a plurality of substrate electrodes on a substrate, the substrate electrodes including initial electrodes and spare electrodes, a bonding material covering the initial electrodes and the spare electrodes, module structures respectively provided on first initial electrodes of the initial electrodes, and solders between each of the first initial electrodes and each of the module structures, wherein the spare electrodes include second spare electrodes, wherein the module structures are not provided on the second spare electrodes, wherein the bonding material on the first initial electrodes is harder than the bonding material on the second spare electrodes.


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