Isehara, Japan

Seiki Sakuyama

This inventor holds 47 USPTO granted patents and 9 published patent applications and 1 EPO patent, primarily in Semiconductor Manufacturing. Top assignees: Fujitsu Corporation, Fujitsu Interconnect Technologies Limited, Fujitsu Semiconductor Limited. Active years: 1997-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seiki Sakuyama. Retrieved from https://idiyas.com/inventor/seiki-sakuyama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 47 

% Patents Active = 74.5

 

Average Co-Inventor Count = 2.3

ph-index = 10

Forward Citations = 257(Granted Patents)


Location History:

  • Kobe, JP (2000 - 2002)
  • Kawasaki, JP (1997 - 2016)
  • Yamoto, JP (2017)
  • Isehara, JP (2014 - 2019)
  • Yamato, JP (2017 - 2021)

Company Filing History:


Years Active: 1997-2021

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Areas of Expertise:
Semiconductor Device
Electronic Device
Circuit Board
Soldering Method
Conductive Material
Bump Electrodes
Manufacturing Method
Printed Wiring Board
Electrical Apparatus
Coating Film
Soldering Flux
Whiskerless Plated Structure
47 patents (USPTO):Explore Patents

Title: Seiki Sakuyama: Innovator in Electronic Device Technology

Introduction

Seiki Sakuyama, based in Isehara, Japan, is a prolific inventor known for his contributions to electronic device technology. With a remarkable portfolio of 47 patents, Sakuyama has made significant advancements in the design and manufacturing processes of electronic components.

Latest Patents

Sakuyama's latest patents showcase his expertise in electronic device development. One patent outlines an innovative electronic device that comprises a first layer containing first electronic components with a specific through space between them. This layer is complemented by a second layer that includes second electronic components, with a partial overlap of spaces to enhance functionality. Another significant patent involves the design of a circuit board featuring a first substrate with a through hole, layered with conductive composite resin to improve electronic connectivity. This patent reflects his dedication to enhancing circuit board efficiency and electronic device performance.

Career Highlights

Throughout his career, Seiki Sakuyama has been associated with renowned companies, including Fujitsu Corporation and The Furukawa Electric Co., Ltd. His work at these esteemed organizations has provided him with invaluable experience, allowing him to pioneer advancements in electronic device innovation.

Collaborations

Sakuyama’s journey has also led him to collaborate with notable professionals in the field, including Kozo Shimizu and Toshiya Akamatsu. These collaborations have fostered a creative environment, facilitating the exchange of ideas that contribute to groundbreaking inventions in the electronics sector.

Conclusion

In summary, Seiki Sakuyama stands out as a leading innovator in the realm of electronic devices. His extensive patent portfolio and successful collaborations highlight his impact on the industry. With each new invention, Sakuyama continues to push the boundaries of technology, ensuring a future ripe with innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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